Fanless Industrial Computer KMDA-3301
Fanless Industrial Computer with Intel® 11th Gen. Tiger Lake-U SoC, TPM2.0 module, 2x DDR4 3200 MHz SO-DIMM, up to 64GB
1x HDMI, 1x DP, for 8K+4K dual display output
3x LAN, iAMT13.0 support, 2x COM, 8-bit DIO
2x USB 3.2, 4x USB 2.0
1x M.2 3052 Key B with SIM card slot support 5G NR module
1 M.2 M-Key, 1x mSATA, 1x SATA3.0
9~36V DC, with short circuit, over voltage and over current protection
Aluminum chassis, fanless design, Desk mounting or DIN-Rail mounting support
Lead time 2-3 days when available
Embedded Box PC for continuous operation with 3x LAN, 2x COM, 6x USB, 8-bit DIO
fanless, rugged, support 4G/5G/WiFi/Bluetooth/GPRS
Intel® 11th Generation (Tiger Lake) CPU list for KMDA-3301
Intel® CPU | Core™ i7-1185G7 | Core™ i5-1145G7 | Core™ i3-1125G4 | Celeron® 6305 |
Cores/Threads | 4/8 | 4/8 | 4/8 | 2/2 |
TDP-up Frequency | 3GHz | 2.6GHz | 2GHz | 1.8GHz |
Max Turbo Frequency | 4.8GHz | 4.4GHz | 3.7GHz | |
CPU TDP | 12W | 12W | 12W | 15W |
Cache | 12MB | 8MB | 8MB | 4MB |
Intel® Deep Learning Boost (Intel® DL Boost) | + | + | + | + |
Intel® vPro® Platform Eligibility | + | + | - | - |
Intel® Hyper-Threading Technology | + | + | + | - |
Intel® Virtualization Technology | + | + | + | + |
Features
Intel® 11th Gen (Tiger Lake) SoC
2x DDR4 SO-DIMM, 3200 MHz, up to 64GB
1x miniPCIe (PCIe x1 and USB 2.0),
support WiFi/Bluetooth modules1x M.2 3052 B-Key, with SIM Slot, PCIe x1 and USB2.0,
support 4G LTE, 5G NR modules1x M.2 2280 M-Key, PCIe x2 Gen4.0 signal,
support high speed signal function cardIntel® UHD Graphics or IRIS® Xe Graphics,
support Intel® DL boost deep learning technology, DirectX 12.1, OpenGL 4.6 and OpenCL 2.01x DP 1.4 max resolution 7680x4320@60Hz
1x HDMI 2.0 max resolution 4096x2304@60Hz3x Intel® I225V, 10/100/1000Mbps/2,5G self-adaptiv,
iAMT13.0 support1x 2.5" SATA 3.0
1x mSATA, AHCI support
1x M.2 2280 M-Key NVME (PCIe x2 Gen 4.0)
8-bit DIO (2x5Pin phoenix terminal)
3x RJ45 2,5 Gb LAN with anti-dust rubber screw hole
2x USB 3.2 (Type A Gen 2.0 on of them with anti-dust rubber), max. 10Gbps data transfer rate
2x USB2.0 (Type A,
one of them with anti-dust rubber screw hole)1x USB2.0 (Type A) internal, 1x USB2.0 internal pin header
2x RS232/422/RS485 (DB9 Male)
1x MIO (opt. internal expansion module)
1x SIM-card slot
1x Audio out, 1x Mic
1x I-port reserved for I/Os, for instance internal
1x USB 2.0 or miniPCIe, M.2 and function modules (like dual Gigabit-LAN module, CAN-Bus or COM modules)LED indicators: 1x RUN, 1x Modem, 1x USR, 1x RSSI, 1x NET,
1x WiFiFanless Design, rugged
Windows 10, Windows 11, Linux: SUSE, Ubuntu; Wind River
Operating Temperature -25 ~ +70 °C
9~36V DC Power Input
Aluminium chassis
Desktop and DIN-Rail mounting
Applications
C-V2X MEC computing
Automated Guided Vehicles (AGV)
AutomationMachine Vision
IoT
Machine Vision