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Fanless Industrial Computer KMDA-3301

  • Intel® 11th Gen. Tiger Lake-U SoC
  • DRAM (DDR4-SODIMM)
  • SSD
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Fanless Industrial Computer with Intel® 11th Gen. Tiger Lake-U SoC, TPM2.0 module, 2x DDR4 3200 MHz SO-DIMM, up to 64GB
1x HDMI, 1x DP, for 8K+4K dual display output
3x LAN, iAMT13.0 support, 2x COM, 8-bit DIO
2x USB 3.2, 4x USB 2.0
1x M.2 3052 Key B with SIM card slot support 5G NR module
1 M.2 M-Key, 1x mSATA, 1x SATA3.0
9~36V DC, with short circuit, over voltage and over current protection
Aluminum chassis, fanless design, Desk mounting or DIN-Rail mounting support


 Lead time 2-3 days when available

Embedded Box PC for continuous operation with 3x LAN, 2x COM, 6x USB, 8-bit DIO

fanless, rugged, support 4G/5G/WiFi/Bluetooth/GPRS

Intel® 11th Generation (Tiger Lake) CPU list for KMDA-3301


Intel® CPUCore™ i7-1185G7
Core™ i5-1145G7
Core™ i3-1115G4
Celeron® 6305
Cores/Threads
4/8
4/8
2/4
2/2
TDP-up Frequency
3GHz
2.6GHz
1.7GHz
1.8GHz
Max Turbo Frequency
4.8GHz
4.4GHz
4.1GHz

CPU TDP
12W
12W
12W
15W
Cache
12MB
8MB
6MB
4MB
Intel® Deep Learning Boost (Intel® DL Boost)
+
+
+
+
Intel® vPro® Platform Eligibility
+
+
-
-
Intel® Hyper-Threading Technology
+
+
+
-
Intel® Virtualization Technology
+
+
+
+

Features


  • Intel® 11th Gen (Tiger Lake) SoC

  • 2x DDR4 SO-DIMM, 3200 MHz, up to 64GB

  • 1x miniPCIe (PCIe x1 and USB 2.0),
    support WiFi/Bluetooth modules

  • 1x M.2 3052 B-Key, with SIM Slot, PCIe x1 and USB2.0,
    support 4G LTE, 5G NR modules

  • 1x M.2 2280 M-Key, PCIe x2 Gen4.0 signal,
    support high speed signal function card

  • Intel® UHD Graphics or IRIS® Xe Graphics,
    support Intel® DL boost deep learning technology, DirectX 12.1, OpenGL 4.6 and OpenCL 2.0

  • 1x DP 1.4 max resolution 7680x4320@60Hz
    1x HDMI 2.0 max resolution 4096x2304@60Hz

  • 3x Intel® I225V, 10/100/1000Mbps/2,5G self-adaptiv,
    iAMT13.0 support

  • 1x 2.5" SATA 3.0

  • 1x mSATA, AHCI support

  • 1x M.2 2280 M-Key NVME (PCIe x2 Gen 4.0)

  • 8-bit DIO (2x5Pin phoenix terminal)

  • 3x RJ45 2,5 Gb LAN with anti-dust rubber screw hole

  • 2x USB 3.2 (Type A Gen 2.0 on of them with anti-dust rubber), max. 10Gbps data transfer rate

  • 2x USB2.0 (Type A,
    one of them with anti-dust rubber screw hole)

  • 1x USB2.0 (Type A) internal, 1x USB2.0 internal pin header

  • 2x RS232/422/RS485 (DB9 Male)

  • 1x MIO (opt. internal expansion module)

  • 1x SIM-card slot

  • 1x Audio out, 1x Mic

  • 1x I-port reserved for I/Os, for instance internal
    1x USB 2.0 or miniPCIe, M.2 and function modules (like dual Gigabit-LAN module, CAN-Bus or COM modules)

  • LED indicators: 1x RUN, 1x Modem, 1x USR, 1x RSSI, 1x NET,
    1x WiFi

  • Fanless Design, rugged

  • Windows 10, Windows 11, Linux: SUSE, Ubuntu; Wind River

  • Operating Temperature -25 ~ +70 °C

  • 9~36V DC Power Input

  • Aluminium chassis

  • Desktop and DIN-Rail mounting 

Applications


  • C-V2X MEC computing

  • Automated Guided Vehicles (AGV)

  • AutomationMachine Vision

  • IoT

  • Machine Vision